Fairphone 2 went this way. Unfortunately it being more modular meant more hardware issues because of friction and such.
So if they went for a standard dimension of everything you mention, it isn't possible on a small scale. Because every device upgrade is an iteration. One might for example have more cameras or more sensors, another time you get an upgrade from microUSB to USB-C, another time the SoC gets updated (they went to an industrial grade now, meant for 8 years of updates). If you look at Project Ara or the project Dave Hakkens' Phoneblocks, these projects are exactly that, and they increase the size of the device massively.
> They don't need to optimize for thinness, they don't need to optimize for performance. They don't need to optimize for heat dissipation. They don't need to optimize for screen size or to ensure that their phone has a stupid notch. I don't care if the phone ends up being 1 cm thick or if it ends up with a 3 mm bezel.
Yeah, that is the gist of your message. You don't care about this, and that, and this, and that, while they need to take it into account. Not as extreme as a non-modular, non-repairable smartphone but still it has to be taken into account. The company is too small for various markets like one where they want the device to be upgradeable between different versions, one where they want a hardware keyboard, one where it is an e-ink screen, one where the form factor is small, etc etc.
For exameple: Look at the small form factor of iPhone Mini and <= 5 inch smartphones. They get axed because there isn't enough demand. And yet the flip seems to be a new rage, seemingly big enough market share.
I get what you described is what YOU want heck I've read it all on the Fairphone forums but the world isn't only about YOU. So that they lose you as customer, who cares? They get more customers in return.