If you can get the parts you need in SSOP or TSSOP packaging, with the pins visible from straight down, laser brazing might work.
Brazing is done at higher temperatures than soldering, but with a laser, you can apply the heat to just the area of interest, and hopefully not cook the ICs. Laser soldering already exists, and there are laser cutters, so adapting one for laser brazing ought to be possible.
The advantage of brazing is that you can use many more materials, most of which don't contain either tin or lead. Low-cost aluminum brazing rod or wire might work. Working temp around 700C. This is going to take careful heat management. Worth a try for aerospace applications.