Apple/Nvidia/AMD/etc buy fab capacity, they understand the differences on a node per node across the various providers. They then manufacture a semi conductor product that has many other factors beyond the process node which others buy, such as consumers/data centers/car manufacturer/etc. Knowing the processing node makes little sense in the buying decision of the latter.
The lines for evaluating the end product are even more blurry once we get into chiplet or big.LITTLE design, both of which mix processing nodes to a lesser or greater degree respectively. Once we actually get to products the overall package needs to be evaluated not the processing node.